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08/09/2009
RadiciGroup at the 51st MSV International Engineering Fair

RadiciGroup will participate in the 51st MSV International Engineering Fair to be held from 14 to 18 September 2009 in Brno, Czech Republic.

Numerous industrial sectors will be represented at this international event sponsored by the Confederation of Industry of the Czech Republic, including: plastics, rubber, chemicals, mining, metallurgic and mechanical engineering, electrical and electronic engineering, logistics, transport and packaging.

At the exhibition, RadiciGroup will present its range of polyamide and polyester engineering plastics sold under the Radilon®, Radiflam®, Raditer®, and Heramid® brand names. These products are mainly used for applications in the automotive, electrical/electronic, industrial and packaging sectors.

Other plastics products offered by RadiciGroup are: polyacetyls (Heraform®), thermoplastic elastomers (Heraflex®), and polyolefin compounds (Radilene®).

For more information on the 51st MSV International Engineering Fair, please visit the official site: http://www.bvv.cz/msv-gb

COME AND SEE US:
HALL G1 – BOOTH 77


For more information on our products and the MSV fair, download the Press Release:

Download File 167Kb
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